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    HMDS预处理系统

    Applied to the semiconductor industry:

    Subsidiary Equipment-Gas Equipment

    In stock:

    99

    Place of origin:

    National

    Quantity:

    cut back increase

    price:

    Negotiable
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    Own series:Subsidiary Equipment-Gas Equipment

    本设备适用于在涂胶、光刻前对晶片进行预处理。设备由腔体、真空、加热、充氮、加液及控制等系统组成。通过多次预抽真空,150?C热氮加热,既能达到使硅片表面干燥、洁净的效果,又能够有效的防止硅片的氧化和杂质的扩散,并且可以通过加液系统在硅片表面生成HDMS保护膜,从而使硅片具有良好的光刻性能。也可用于晶片其它工艺的清洗。控制采用PLC,人机界面采用触摸屏,具有可靠性高,操作方便、直观等特点。
      主要技术指标
      整机尺寸:600x620X1260mm3
      真空腔体尺寸:450×450×450mm;材质:不锈钢
      双层承片板,承片板尺寸:420×410mm;上下层距离190mm
      整机消耗电源AC220V,2KW
      采用2XZ-4真空泵,系统可达到真空度-100Kpa
      加热方式:腔体下部及两侧加温。加热器为内置加热板,功率1.5KW,腔体温度:20℃~160℃±2℃;可调
      配HMDS液体一瓶

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