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    CMP抛光系统

    Applied to the semiconductor industry:

    Processing Equipment-Lapping&Polishing-CMP磨抛机

    Specification model:

    IB400

    Delivery period:

    4个月Day

    In stock:

    1

    Place of origin:

    Germany

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:

    model:IB400

    Own series:Processing Equipment-Lapping&Polishing-CMP磨抛机

    详细描述:

    1.加工样品尺寸4英寸及以下尺寸样品

    2.可磨抛样品数量设备具有1个工位,最大可以加工4英寸样品.
    3.可加工样品种类Si,SiC, GaAs, InP,CZT, MCT等多种半导体材料
    4.整机防腐蚀,适用CMP应用设备主机及所有零部件耐腐蚀,适用CMP应用
    5.设备工作时间,磨抛盘转速,样品固定系统驱动转速及摆幅等参数采用精确数控,所有参数具有数据存储及记忆功能。所有控制系统部件上置于磨抛工作区域,以避免磨抛工作过程中磨抛废料渗漏腐蚀操控系统。

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