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    Laser Machining System

    Applied to the semiconductor industry:

    Processing Equipment

    Specification model:

    MLPS-50PS

    In stock:

    1000

    Place of origin:

    China-北京市

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

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    Brand:

    model:MLPS-50PS

    Own series:Processing Equipment

     

    Research-based Multifunctional Laser Machining System MLPS-50PS

    The system mainly aims at scientific research customers and provides laser processing platform for many kinds of materials. It can cut, scribe, groove and mark the vast majority of materials. The specific parameters are as follows: 

     

    Technical parameters:

    Scan range

    mm

    60×60(Or customization)

    X/Y stroke

    mm

    200×200

    Minimum line width

    μm

    20

    Scanning Processing Speed

    mm/s

    ≤4000

    Maximum moving speed of platform

    m/min

    18

    Processing mode

    Double head switching

    Scanning type A (subgraph, layered, zoom)/B straight cut type

     

         
         
         
         
         
       

     

     

    Applications:

    Precision micro machining industry, such as polymer film ITO scribed line, metal ceramic composite materials cutting, LTCC/Al2O3 ceramic cutting manufacture, biodegradable polymers, blood vessels and microstructure, polymer film cold working, the gear processing, micro silicon micro drilling, PCB drilling, ceramics and glass micro drilling, glass microchannel processing, sapphire stone groove, polycrystalline diamond nozzle processing.Diamond wheel micro-structure manufacturing and other fields, especially suitable for precision processing experiments of various materials in the field of scientific research.

    Laser source can be replaced by other kinds of lasers, such as green nanosecond short pulse solid state lasers, to process hard and brittle materials, such as glass cutting, drilling, PCB cutting, diamond cutting and so on. Details, please contact us.

    Cutting Classify System

    Cutting Classification Processing System RS-7000G Lokorokko

    main features

    Excellent production performance UPH: 15,000 (handling placement device only)

    Three linear slider transport line [standard]

    Cutting System with Double Axis and Double Clamp Table (EAD 6340R)

    Live bug [standard equipment]

    Placement: disc/tube/barrel

    Noise level below 70 decibels

    Precision Video Detection System

     

                                                                                         Machining of Diamond Wheel



                                   CVD cutting                                                          Diamond etching                   

    Note: Laser source can be replaced by other kinds of lasers, such as green nanosecond short pulse solid state lasers, to process hard and brittle materials, such as glass cutting, drilling, PCB cutting, diamond cutting and so on. Details, please contact us.

     

    advisory

    If you have any questions before purchasing, please contact us.

    Question:
     

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