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    Plasma Etching Equipment

    Applied to the semiconductor industry:

    Processing Equipment-Etching-高密度等离子体刻蚀机

    Product brand

    Oxford

    Specification model:

    PlasmaPro100 Polaris

    In stock:

    100

    Place of origin:

    United Kingdom

    Quantity:

    cut back increase

    price:

    100000.00
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

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    Negotiable

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    ¥10000.00

    Concerned Products

    Brand:Oxford

    model:PlasmaPro100 Polaris

    Own series:Processing Equipment-Etching-高密度等离子体刻蚀机

    等离子刻蚀设备 牛津PlasmaPro100 Polaris 高端刻蚀工艺

    牛津仪器专业为中国企业、科研单位打造等离子刻蚀设备,可实现碳化硅深孔刻蚀工艺,深度达到
    100um以上

    精湛的精密刻蚀工艺 ,超过百家企业,科研单位,选择我们量身定制设备,欢迎来电咨询:010-57168280 赵小姐

    PlasmaPro100 Polaris
    1.深孔碳化硅刻蚀工艺的关键因素
    2.深孔碳化硅刻蚀工艺的关键技术开发与成果
    3.达成深孔碳化硅刻蚀:设备需具有的关键条件
    4.Polaris具体设计的特点
    5.可操作在低功率低偏压之起辉模式
    6.单晶片夹具解决方案
    7.Hardware Components-最在化抽气链结
    8.从硬件设计与工艺角度,总结Polaris的优异性能























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    If you have any questions before purchasing, please contact us.

    Question:
     
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    请问你们是国内总代吗?

    qingqingyuan  2017-06-29

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