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    Etching Equipment

    Applied to the semiconductor industry:

    Processing Equipment-Etching-高密度等离子体刻蚀机

    Product brand

    Leuven

    Specification model:

    LCCP- 6A

    In stock:

    100

    Place of origin:

    China-北京市

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

    Brand:Leuven

    model:LCCP- 6A

    Own series:Processing Equipment-Etching-高密度等离子体刻蚀机

     

    LCCP-6A Automatic Etching Machine

    System introduction

    LCCP-6A full-automatic RIE etcher produced by Leuven Instrument is a common etcher in laboratory.

    F-based gas etching Si, SiO 2, SiN, Poly-Si, Ge, W, Mo, Ta, quartz, etc. Oxygen can also be used to remove photoresist and etch organic film.

    The etching process is fully automatic. The software includes the recommended process menu of etching materials. It is easy to operate, good repeatability and durable.

    The minimum etching line width can be up to 200 nm.

    The etching rate varies with the material, generally from 100 to 500 nm/min.

     


    Machine performance

    1. Etching rate: 100-500 nm/min (depending on the material being etched).

    2. Etching uniformity: <5% (6 "wafers).

    Main Configuration of Standard Model

    1. Anodic alumina chamber;

    2. Molecular pump and mechanical pump high vacuum unit;

    3. Radio frequency power supply with automatic matcher;

    4. Digital vacuum gauge and pressure switch;

    5. Five standard sets of gas system and digital flowmeter can be customized to increase or decrease.

    6. Pressure regulating valves, high valves and low valves;

    7. Integrating industrial computer with touch screen, it has strict safety measures such as leak detection, interlocking and alarm.

    8. It has He backcooling and water cooling system, which can cool the substrate to be processed.

    case analysis

    1. SiO 2 uniformity (Fig. 1)

    L. Process conditions: sample size 6 inches, etching gases such as CF4

    1. The etching time was 35 seconds, 70 seconds and 120 seconds. The uniformity of the film Nano-Aperture analyzer and step analyzer were (+2.4%), (+2.6%) and (+1.7%) respectively. This parameter is superior to most of the products on the market (the industry is usually (+5%).

    2. Si3N4 uniformity (Fig. 2)

    L. Process conditions: sample size 4 inches, etching gases such as CF4

    1. The etching time was 40 seconds, 70 seconds, 140 seconds and 280 seconds. The uniformity of the film nanopore analyzer and step analyzer were (+2.1%), (+2.3%) and (+1.3%) and (+2.0%) respectively. This parameter is superior to most of the products on the market (the industry is usually (+5%).

    3.4 inch Si uniformity (Fig. 3)

    L. Process conditions: etching gases such as CF4

    L The test time of silicon wafer is 500 seconds and 625 seconds, and the uniformity of the test is (+2.85%) and (+1.12%) respectively. This parameter is superior to most of the products on the market (the industry is usually (+5%).

    4. 6 inch Si uniformity (Fig. 4)

    L. Process conditions: etching gases such as CF4

    1. The test time of silicon wafer is 300 seconds, and the uniformity of the test is (+2.99%). This parameter is superior to most of the products on the market (the industry is usually (+5%).

    1. SiN etching steepness (Fig. 5, Fig. 6)

    L. Process conditions: etching gases such as CHF3 and CF4

    L. The etching line is very steep.

    2. SiO 2 etching steepness (Figures 7 and 8)

    L. Process conditions: etching gases such as CHF3 and CF4

    L. The etching line is very steep.

     





    about us

     

    Jiangsu Luwen Instruments Co., Ltd. was established by the Belgian Luwen Instruments and the Institute of Microelectronics, Chinese Academy of Sciences. The company is headquartered in Pizhou City, Jiangsu Province, with R & D center and sales department in Belgium, Beijing and Russia in the sales offices. Adhering to the tenet of "innovation as the leading factor, customer trust as the first", the company advocates the spirit of craftsmen striving for excellence, providing customers with precision equipment and supporting technical services such as semiconductor research and development, production, material testing and so on.

    The company aims to develop and manufacture the instruments and equipment needed by laboratories, research institutes and semiconductor production lines of universities, aiming at the customized market. The main products are Nano-Aperture analyzer for thin film materials, high-end platform etcher, plasma etching equipment, chemical vapor deposition equipment, sputtering film coating equipment, atomic coating equipment, wet cleaning and etching equipment, etc. The company has independent patented technology, and the core product technology is internationally advanced.

    The company insists on people-oriented, and its technical team includes Nobel Prize winners, two experts of the "1000-person Program", many well-known professors in semiconductor field at home and abroad, and young technical backbone of scientific research institutes in Colleges and universities. The international first-class talent team has laid a solid foundation for the company to maintain technological leadership and achieve innovation-driven.

    The company is committed to becoming the world's first-class semiconductor equipment supplier, willing to work with customers, suppliers, industry colleagues and investors to explore and create a broad future in the field of semiconductor equipment!


     

    advisory

    If you have any questions before purchasing, please contact us.

    Question:
     
    Ask

    能刻蚀的最大深度能不能到100微米?浅处和最深处宽度差多少?

    hjool  2017-07-24

     刻蚀深度与光刻效果、刻蚀材料、选择比、光刻胶、选择的气体等等都有关系。不能简单得来描述能否刻蚀多深,还要落实到具体要求上。可以留联系方式,电话沟通

    2017-07-25

    Ask

    请问你们这台设备的排气有没有回收装置或者废气处理装置?精度怎么样?

    caoweihuo  2017-07-11

     尾气处理都是第三方公司来处理,这台设备没有尾气处理装置。
    可以留个联系方式,具体事宜可以面谈

    2017-07-20

    Ask

    多少路气体的,加工几寸规格的?

    dssj  2017-07-13

     您好。设备气路根据您的需求定制,要是刻蚀硅材料,通常5路气体:CF4、CHF3、SF6、O2、Ar。样品尺寸可以根据要求定制,目前可以加工6英寸及以下尺寸样品。
    可以留联系方式,有机会可以面谈。我的电话13811844891

    2017-07-20

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