Shipping
关注:152
全自动倒装芯片焊接机(Filp-Chip Bonder M-400)
In stock:
99
Place of origin:
China-江苏省
Hot products
Concerned Products
- product details
- Product parameters
- Packing List
- after-sale warranty
全自动倒装芯片焊接机(Filp-Chip Bonder M-400)
- 支持各种封装技术:热压合/共晶焊接/胶合/图像接口/CCD校正 (Image processing, CCD alignment, Thermo-compression/adhesive with a dispenser, and eutectic solder bonding.)
- 运用图像处理亦可支持破片晶圆 (including broken or chipped wafers)。
- 额外应用:雷射量测/紫外线光 (Laser measurement/UV/Ultra Sonic)。
- 精度:±2.5μm
advisory
If you have any questions before purchasing, please contact us.
Loading transaction history...