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    全自动倒装芯片焊接机(Filp-Chip Bonder M-400)

    Applied to the semiconductor industry:

    Packing Equipment-Welding

    In stock:

    99

    Place of origin:

    China-江苏省

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    全自动倒装芯片焊接机(Filp-Chip Bonder M-400)

    1. 支持各种封装技术:热压合/共晶焊接/胶合/图像接口/CCD校正 (Image processing, CCD alignment, Thermo-compression/adhesive with a dispenser, and eutectic solder bonding.)
    2. 运用图像处理亦可支持破片晶圆 (including broken or chipped wafers)。
    3. 额外应用:雷射量测/紫外线光 (Laser measurement/UV/Ultra Sonic)。
    4. 精度:±2.5μm
     

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