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高精度倒装芯片焊接机(High Accuracy Filp-Chip Bonder M-1300)
In stock:
100
Place of origin:
China-江苏省
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高精度倒装芯片焊接机(High Accuracy Filp-Chip Bonder M-1300)
- 适用于雷射相关或/光学产品封装产业或是需超高精度封装类型 (for laser-assisted packaging, optical device packaging)
- 额外应用:雷射量测/紫外线光 (Laser measurement/UV/Ultra Sonic)。
- 精度:±1μm。
- 可应用在研发/实验室 (used for R&D or Lab.)
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