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    高精度倒装芯片焊接机(High Accuracy Filp-Chip Bonder M-1300)

    Applied to the semiconductor industry:

    Packing Equipment-Welding

    In stock:

    100

    Place of origin:

    China-江苏省

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:

    model:

    Own series:Packing Equipment-Welding

    高精度倒装芯片焊接机(High Accuracy Filp-Chip Bonder M-1300)

    1. 适用于雷射相关或/光学产品封装产业或是需超高精度封装类型 (for laser-assisted packaging, optical device packaging)
    2. 额外应用:雷射量测/紫外线光 (Laser measurement/UV/Ultra Sonic)。
    3. 精度:±1μm。
    4. 可应用在研发/实验室 (used for R&D or Lab.)
     

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