Website Homepage

CN|EN

Current Position: Home » Equipment » Sensor and Chip » Chip » MEMS芯片类 »MD高稳定型压力芯片
    Shipping 关注:99

    MD高稳定型压力芯片

    Applied to the semiconductor industry:

    Sensor and Chip-Chip-MEMS芯片类

    In stock:

    10000

    Place of origin:

    China-重庆市

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

    Hot products

    followed36451

    Negotiable

    followed8875

    Negotiable

    followed2917

    Negotiable

    followed2248

    ¥10000.00

    Concerned Products

    Brand:

    model:

    Own series:Sensor and Chip-Chip-MEMS芯片类

     产品优势:

    1)全球最优   高纯度单晶硅材质

    2)全球独创   双梁悬浮式 MEMS 结构

    3)全球第一   超高过压性能

    4)全球最小   1kPa 标准量程

    产品参数:

    量程与输出

     

    膜盒 压力量程 满量程电压 (mV,a+5V)
    MD1 1kPa 17
    MD2 6kPa 62.5
    MD3 40kPa 99.5
    MD4 100kPa 22.5
    MD5 200kPa 45
    MD6 400kPa 90
    MD7 4MPa 150
    MD8 40MPa 120

     


    特性参数
    (在I=0.3mA,T=23℃下测量)
    参数 min typ max Unit
    桥阻 9.5 10 10.5  kΩ
    偏移电压 -3 0 +3 mV / V
    供电电压 - 3 10 V
    供电电流 - 0.3 1 mA
    桥阻的温度系数 0.5 0.8 1.2 %FS/10K
    零点的温度系数 -0.04 ±0.06 +0.08 %FS/10K
    满点的温度系数 -0.05 -0.08 -0.15 %FS/10K
    温度零点回差(42h)
    (30℃~135℃~30℃)
    0.02 1 2 uV / V
    静压特性 - ≤0.03  - ±%FS/10MPa
    长期稳定性
    (1000h,135℃)
    - ≤3 ±5 uV / V
    非线性 - ≤1% - ±%FS
    灵敏度    
    MD1-MD2
    6 8 10 mV / V
    灵敏度    
    MD3-MD8
    15 20 25 mV / V
     
    工作压力(静压)
    膜盒 过压(背面) 过压(正面)
    MD1 1MPa 1.5MPa
    MD2 1.5MPa 2.5MPa
    MD3 2MPa 3.5MPa
    MD4 10MPa 10MPa
    MD5 10MPa 10MPa
    MD6 10MPa 10MPa
    MD7 13MPa 20MPa
    MD8 - 100MPa

    advisory

    If you have any questions before purchasing, please contact us.

    Question:
     

    Related similar products in semiconductor industry:

    Service Hotline

    4001027270

    Function and characteristics

    Prices and offers

    WeChat public number