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    HMD超宽温区压力芯片

    Applied to the semiconductor industry:

    Sensor and Chip-Chip-MEMS芯片类

    In stock:

    10000

    Place of origin:

    China-重庆市

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

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    model:

    Own series:Sensor and Chip-Chip-MEMS芯片类

     产品优势:

    1)无与伦比的超宽温区特性:-200℃~350℃

    2)独特的SOI工艺,实现高温特性

    3)首创桥阻30 kΩ,微小零点偏移,极佳温度特性

    3)高稳定性,适合高端应用
    产品参数:

    量程与过压

     

    型号 压力量程 单边过压
    HMD2 10kPa 400kPa
    HMD3 40kPa 1MPa
    HMD4 400kPa 1MPa
    HMD5 4MPa 10MPa
    HMD6 40MPa 100MPa


     

    特性参数

     (在I=0.3mA和 23℃下测量):

    参数 min  typ  max   Unit  
    桥阻 27 30 33
    偏移电压 -5    2 +5  mV/V 
    供电电压 - 3 10 V
    供电电流 - 0.3 1 mA
    桥阻的温度系数 +0.05 +0.08 +0.12 %FS/K
    零点的温度系数   -0.05 ±0.03 +0.05 %FS/K
    满点的温度系数  -0.05 -0.08   -0.15  %FS/K

    回差(42h

    (30°C~135°C~30°C)

    -5 ±2 5 uV/V
    静压特性  ≤0.05  1 +%FS/10MPa

    长期稳定性 

    (1000h,135°C)

    ≤5  +20 uV/V
    非线性   ≤1  +%FS
    灵敏度 5 10 mV/V

     

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