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    F&K Delvotec引线键合 创世杰科技

    Applied to the semiconductor industry:

    Processing Equipment-Bonding-引线键合机

    Product brand

    创世杰科技

    In stock:

    100

    Place of origin:

    National

    Quantity:

    cut back increase

    price:

    1000.00
    Transaction guarantee Secured Transactions Online banking to pay

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    ¥10000.00

    Concerned Products

    Brand:创世杰科技

    model:

    Own series:Processing Equipment-Bonding-引线键合机

    Wire Bonder G5 Single –
    全自动单头键合机
    根据不同工艺要求,更换适宜的键合模块,特别适用于封装中的深腔球焊
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    Wire Bonder G5-2 –
    全自动双头键合机
    在一台设备上安装两个不同的键合模块同时工作,有效节约空间,适用于高速,高产能,高质量应用.
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    Wire Bonder G5-XL –
    超大工作区域键合机
    超大工作区域 1130 mm x 700 mm, 适用于太阳能电池板和汽车电池组键合.
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