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    EPA - 自动电镀

    Applied to the semiconductor industry:

    Processing Equipment-PVD-电镀类设备

    In stock:

    1000

    Place of origin:

    China-上海市

    Quantity:

    cut back increase

    price:

    Negotiable
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    Own series:Processing Equipment-PVD-电镀类设备

     
    自动系统中使用的电化学沉积
    金属单质与合金沉积,如金、银、铜、锡、镍、硅化银,可在半导体和微系统技术中发挥不同的作用。导电液流速的提高和对电场更好的控制可以确保在较高镀速下的均匀沉积。
    RENA 为特殊应用场合提供个性化解决方案。
    特点和优势:
    在 电镀工具研究领域拥有 15 余载的专业经验
    具最高灵活性的模块化设计
    边缘剔除小于 3mm
    矩形基板的尺寸可以为 4"、 6"、 8"、 12" 或按照特殊的硅片尺寸做相应调整

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