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    Bumping錫膏

    Applied to the semiconductor industry:

    Pack-Equip Consumable-Sealing

    In stock:

    10000

    Place of origin:

    China-江苏省

    Quantity:

    cut back increase

    Price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:

    Model:

    Own series:Pack-Equip Consumable-Sealing

     

    Bumping錫膏

    產品說明
    針對封裝晶圓等產品需求,我司開發小粒徑錫膏因應此高規產品需求。經第三方權威檢測機構檢測認證,其品質完全符合歐盟RoHS標準!並為客戶提供信賴性檢測報告。
    特性

    極佳的潤濕與吃錫能力
    可長時間(8hrs)印刷
    低氣泡與孔洞
     
    良好冷坍塌能力
    不易黏著至刮刀,減少錫膏裙擺殘留


    Bumpping錫膏

    Advisory

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