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产品规格 Product Specification |
产品名称Product Name |
多晶硅片Multi-Crystalline Si wafer |
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文件名称document Name |
156×156多晶硅片产品规格 156×156Multi-Crystalline wafer specification |
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材料特性Material properties |
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边长Dimensions(W×W) |
156×156±0.5mm |
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直径Diameter |
219.2±0.5mm |
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厚度Thickness |
200±20μm |
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电阻率Resistivity |
1~3Ω×cm |
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拉制方式Drawn way |
浇铸法Casting method |
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掺杂剂/型号Dopant/ Donor type |
Boron/ P |
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少子寿命Lifetime |
≥1ms |
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氧含量Oxygen Content |
＜1×1018/cm3 |
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碳含量Carbon Content |
＜5×1017/cm3 |
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线痕Saw marks |
深度≤15mm Depth≤15mm |
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TTV |
≤30mm |
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垂直度Right Angle |
90°±0.3° |
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翘曲度Warp |
≤75mm |
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碎片率Fragmentation rate |
≤3‰ |
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崩边Edge Chip |
崩边宽度≤0.3 mm，长度≤0.5mm，数量≤2个。 Wide≤0.5 mm，Length≤1.0mm，Count≤2。 |
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表面质量Surface quality |
产品表面光洁，无油污、裂纹、针孔。 Cleaned,no grease stains, No crack or pinhole |
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微晶Microcrystal |
无 |
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