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ENGIS化合物材料研磨机Lapping Machine
Product brand
engis
Specification model:
2寸3寸4寸
In stock:
1000
Place of origin:
Japan
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是否有现货: |
否 |
品牌: |
Engis |
自动化程度: |
半自动 |
是否加工定制: |
是 |
电流: |
直流 |
规格: |
2寸3寸4寸 |
商标: |
Engis |
|
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操作界面人性化,人机交流非常简易
使用大粒径研磨液将Wafer快速减薄
可以精确控制Wafer目标厚度,将Wafer减薄至接近目标厚度时,借助厚度控制夹具Wafer将悬空丌再被研磨
可以双头、单片、多片加工,适合研发、量产,可兼容多尺寸Wafer