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        ENGIS化合物材料研磨机Lapping Machine
 
        
         
        
        
                        
                
Product brand
engis
                
                                 
                
Specification model:
2寸3寸4寸
                
                                         
                
In stock:
1000
                
                
                
Place of origin:
Japan
                
                                                      
       
                                        
            
 
 
    
              
 
      
         
     
    
 
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            | 是否有现货: | 
            否 | 
            品牌: | 
            Engis | 
        
        
            | 自动化程度: | 
            半自动 | 
            是否加工定制: | 
            是 | 
        
        
            | 电流: | 
            直流 | 
            规格: | 
            2寸3寸4寸 | 
        
        
            | 商标: | 
            Engis | 
              | 
        
    
                      
                 
                
                  
                   
                   
                  
                   
                  
                                     
                  
                  
                  
                  
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使用大粒径研磨液将Wafer快速减薄
可以精确控制Wafer目标厚度,将Wafer减薄至接近目标厚度时,借助厚度控制夹具Wafer将悬空丌再被研磨
可以双头、单片、多片加工,适合研发、量产,可兼容多尺寸Wafer