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    【ENGIS】化合物半导体材料(GaN/SiC)研削机半自动单轴研磨机

    Applied to the semiconductor industry:

    Processing Equipment-Lapping&Polishing-磨削机

    Product brand

    engis

    Specification model:

    EVG-200 6寸 EVG-250 8寸

    Delivery period:

    90天Day

    In stock:

    1000

    Place of origin:

    Japan

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

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    ¥10000.00

    Concerned Products

    Brand:engis

    model:EVG-200 6寸 EVG-250 8寸

    Own series:Processing Equipment-Lapping&Polishing-磨削机

    engis6、8寸研磨机engis6、8寸研削机 Engis EVG 200,半自动单轴研削机(8寸以下兼容),该设备人工上下片,自动研磨

     

    Engis EVG 250,半自动单轴研削机(10寸以下兼容),该设备人工上下片,自动研磨,自动修整磨轮(针对SiC开发),自动测定厚度

    以上是Grinding方式减薄晶圆

     

    Engis EJW400IFN,单面研磨机(4寸以下兼容),该设备通过lapping方式对晶圆进行减薄,非常适合InP/GaAs等试验及小批量生产加工

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