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    日东电工MA3000III半自动晶圆贴片机

    Applied to the semiconductor industry:

    Processing Equipment-Wafer Bonder-自动粘片机

    Product brand

    日东电工

    In stock:

    10

    Place of origin:

    Japan

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:日东电工

    model:

    Own series:Processing Equipment-Wafer Bonder-自动粘片机

       这是一款半自动晶圆贴膜机,可将切割胶带粘贴在晶圆背面/切割框架上
     
    MA3000III-卷胶带专用
     
    用于 300 mm 晶圆的半自动晶圆贴膜机(卷胶带)
     
    工作台加热功能:
     
    触摸面板,便于操作
     
    符合 CE 标志/SEMI S2/S8规范要求
     
    可用框架尺寸:300 mm/200 mm
     
    可用晶圆尺寸:300 mm/200 mm
     
    可用晶圆厚度:300 um 晶圆:200 um 或更厚(接触工作台)、250 um 或更厚(非接触工作台)、200 um 晶圆:200 um 或更厚(接触工作台)、250 um 或更厚(非接触工作台)
     
    吞吐量:应用 40秒/晶圆 

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