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    ENGIS上蜡压片机贴片机bondingGaAs,InP

    Applied to the semiconductor industry:

    Processing Equipment-Wafer Bonder-自动粘片机

    Product brand

    Engis

    In stock:

    1

    Place of origin:

    Japan

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:Engis

    model:

    Own series:Processing Equipment-Wafer Bonder-自动粘片机

     
    贴片机1


    贴片机2贴片机3品牌:Engis

    化合物半导体(GaAs/InP)背面减薄工艺设备

    应用领域:GaAs,InP

    设备特点:

    上蜡后将陶瓷盘放入压片机真空腔内进行压片,并将Wafer不陶瓷盘间隙内空气排空

    真空腔内设有硅胶垫,上片均匀性非常理想

    配合冷水机使用,缩短上片时间

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