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自动化边缘曝光系统
模型2012SM
2012SM型自动边缘曝光系统为使用标准阴影掩模技术的边缘珠去除提供了一种经济高效的方法。 设计用于容纳8“到300mm的晶片，该工具具有自动FOUP装载。 掩模和基材切换可以快速且容易地实现，从而增加该生产工具的通用性和高产量。
Automated Edge-Bead Exposure SystemModel 2012SM
The Model 2012SM Automated Edge-bead Exposure System provides a cost-effective method for edge-bead removal using standard shadow mask technology. Designed to accommodate wafers from 8” to 300mm, the tool features automated FOUP loading. Mask and substrate changeover can be accomplished quickly and easily adding to both versatility and high-volume throughput of this production tool.
