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    耐高温黄膜贴膜机

    Applied to the semiconductor industry:

    Processing Equipment-Wafer Bonder-贴膜机

    Product brand

    海展

    Specification model:

    客户指定

    Delivery period:

    60天Day

    In stock:

    1

    Place of origin:

    National

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

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    ¥10000.00

    Concerned Products

    Brand:海展

    model:客户指定

    Own series:Processing Equipment-Wafer Bonder-贴膜机


    贴膜机技术参数
    设备名称
    半自动条片贴膜机
    设备型号
    SSM-200
    设备功能
    将定长度的黄膜贴于QFN产品相应位置之上
    设备尺寸
    1100x570x1600(长x宽x高)
    贴膜位置左右精度
    相对QFN中心线±0.2mm
    贴膜位置前后精度
    0-0.3 mm
    设备自动化程度
    半自动。手动放置产品,按下真空按钮、开始按钮后,设备自动拉膜,自动贴膜,内部自动定长切断膜,自动释放真空,手动取下产品。
    贴膜效率
    90-100片/小时
    产品大小
    150-250 mm长度范围内, 50-80 mm宽度范围内
    适用软膜类型
    与尺寸
    耐高温软黄膜
    膜宽度45~75mm
    供气压力
    0.5MPa 干燥压缩空气
    供电要求
    220 V;50/60 Hz;5A
    设备净重
    100kg

    advisory

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