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    HW3801 贴膜机

    Applied to the semiconductor industry:

    Processing Equipment-Wafer Bonder-贴膜机

    In stock:

    10000

    Place of origin:

    China-辽宁省

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

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    ¥10000.00

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    model:

    Own series:Processing Equipment-Wafer Bonder-贴膜机

     
    产品详情

    产品特点:

    1. 无气泡快速贴膜,操作简单快捷

    2. 贴膜机滚轮硬度可达30度

    3. 贴膜晶片位置精度±1mm

    4. 工作台面特氟龙处理,有效保护晶片表面

    5. 滚轮装置设置可调,适用不同厚度晶片

    6. 加热可调,范围室温—80度

    7. 带有卷膜系统,使用双层膜UV膜时,可快速收拢保护膜

    8. 配件采用SMC、欧姆龙、三菱、天逸等知名品牌

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