The PlasmaPro 100 RIE modules deliver anisotropic dry etching for an extensive range of processes.

• Compatible with all wafer sizes up to 200mm
• Rapid change between wafer sizes
• Low cost of ownership and ease of serviceability
• Excellent uniformity, high throughput and high precision processes
• In-situ chamber cleaning and end-pointing
• Wide temperature range electrode, -150°C to 400°C
  

• III-V etch processes
• Solid State Lasers InP etch
• VCSEL GaAs/AlGaAs etch
• RF device low damage GaN etch
• Diamond Like Carbon (DLC) deposition
• SiO₂ and quartz etch
• Failure analysis dry etch de-processing ranging from packaged chip and die etch through to full 200mm wafer etch

• Delivers reactive species to the substrate, with a uniform high conductance path through the chamber
  Allows a high gas flow to be used while maintaining low pressure
• Wide temperature range electrode (-150°C to +400°C)
  which can be cooled by liquid nitrogen, a fluid re-circulating chiller or resistively heated - An optional blow out and fluid exchange unit can automate the process of switching modes
• A fluid controlled electrode fed by a re-circulating chiller unit
  Excellent substrate temperature control
• High pumping capacity - gives wide process pressure window
• Wafer clamping with He backside cooling
  Optimum wafer temperature control
  

Gas pod - incorporate extra gas lines and allow greater flexibility

Logviewer software - datalogging software allows realtime graphing and post run analysis

Optical end point detectors - an important tool for achieving optimal process results

Soft pump - allows the slow pumping down of a vacuum chamber

Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput

X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’

Advanced Energy Paramount generator - Offering increased reliability and greater plasma stability

Automatic pressure control - This controller ensures very fast and accurate pressure control

Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve

LN2 autochangeover unit - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid

TEOS liquid level sensing - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister

Wide temperature range electrode - significant design improvements to increase process performance