Website Homepage

CN|EN

Current Position: Home » Equipment » Processing Equipment » Wafer Bonder »晶圆贴膜机
    Shipping 关注:215

    晶圆贴膜机

    Applied to the semiconductor industry:

    Processing Equipment-Wafer Bonder

    Product brand

    海展

    Specification model:

    MWM-10

    Delivery period:

    45天Day

    In stock:

    6

    Place of origin:

    China-上海市

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

    Brand:海展

    model:MWM-10

    Own series:Processing Equipment-Wafer Bonder

     该设备用于Wafer 切割前的贴膜工序,即在Waferframe上贴蓝膜或者UV膜。

    advisory

    If you have any questions before purchasing, please contact us.

    Question:
     

    Related similar products in semiconductor industry:

    Service Hotline

    4001027270

    Function and characteristics

    Prices and offers

    WeChat public number