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Current Position: Home » Equipment » Processing Equipment » Dicing »OPTO 划片后解理机裂片机（LD）
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    OPTO 划片后解理机裂片机（LD）

    Applied to the semiconductor industry：

    Processing Equipment-Dicing

    Product brand

    opto

    Specification model：

    (W)700×(D)700×(H)1400mm

    Delivery period：

    90天Day

    In stock：

    1000

    Place of origin：

    Japan

    Quantity：

    cut back increase

    price：

    Negotiable
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    Brand：opto

    model：(W)700×(D)700×(H)1400mm

    Own series：Processing Equipment-Dicing

     本机台系将完成SCRIBE 后之芯片以自动对位进行自动劈开之设备。
    1. 用陶瓷劈刀自动裂片，能够利用图像处理装置自动找平已划片LD bar（条形巴）两端并找到开始芯片
    位置后进行裂片。
    2. 具有一次裂片，二次裂片及全划线裂片功能。裂片程序可存储及调出，能够自动记录裂片芯片数量及
    陶瓷劈刀使用次数。
    3. 具有图像预扫描功能，同比其他厂家机台，产能可提升一倍。
    4. 裂片力度可通过螺旋测微距等装置来调节。
    OPTO解理机裂片机（InP GaAs) (2)

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