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    OPTO 划片后解理机裂片机(LD)

    Applied to the semiconductor industry:

    Processing Equipment-Dicing

    Product brand

    opto

    Specification model:

    (W)700×(D)700×(H)1400mm

    Delivery period:

    90天Day

    In stock:

    1000

    Place of origin:

    Japan

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

    Brand:opto

    model:(W)700×(D)700×(H)1400mm

    Own series:Processing Equipment-Dicing

     本机台系将完成SCRIBE 后之芯片以自动对位进行自动劈开之设备。
    1. 用陶瓷劈刀自动裂片,能够利用图像处理装置自动找平已划片LD bar(条形巴)两端并找到开始芯片
    位置后进行裂片。
    2. 具有一次裂片,二次裂片及全划线裂片功能。裂片程序可存储及调出,能够自动记录裂片芯片数量及
    陶瓷劈刀使用次数。
    3. 具有图像预扫描功能,同比其他厂家机台,产能可提升一倍。
    4. 裂片力度可通过螺旋测微距等装置来调节。
    OPTO解理机裂片机(InP  GaAs) (2)

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