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    晶圆激光切割机

    Applied to the semiconductor industry:

    Processing Equipment-Dicing

    Product brand

    msw

    In stock:

    10

    Place of origin:

    National

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

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    Brand:msw

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    Own series:Processing Equipment-Dicing

     激光晶圆切割机,选用工业激光器作为光源,辅以直线电机工作台及直驱旋转平台、CCD影像监视定位、对半导体晶圆进行切割。

    红外激光晶圆划片机技术参数
    激光器:光纤激光器
    激光波长:1064nm
    额定功率:20W@20KHz
    直线电机工作台定位精度:2um
    直线电机工作台有效行程:300mmх300mm
    CCD定位精度:5um 
    最小切割线宽:0.020mm
    旋转范围: 360 度
    旋转精度:0.0001度
    紫外激光晶圆切割机

    应用于硅晶圆、Ⅲ-Ⅴ族晶圆、LOW-K材料的D&B开槽和切割,
    适用于双台面玻璃钝化可控硅体晶圆的划片和切割。
     
    紫外激光晶圆划片机技术参数
    激光器:调Q半导体泵浦紫外激光器
    激光物质:Nd:YVO4
    激光波长:355nm
    额定功率:5W@30KHz
    直线电机工作台定位精度:2um
    直线电机工作台有效行程:300mmх300mm
    CCD定位精度:5um 
    最小切割线宽:0.020mm
    旋转范围: 360 度
    旋转精度:0.0001度

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    If you have any questions before purchasing, please contact us.

    Question:
     
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    可以自动变焦吗?能切多深的切槽?

    wole  2017-07-28

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